Google’s upcoming Pixel 10 is set to feature the innovative Tensor G5 chip, marking a significant departure from its reliance on Samsung. This represents Google’s first fully self-designed processor, with manufacturing now entrusted to TSMC. The transition from Samsung to TSMC showcases a bold strategic shift, as Google integrates a unique mix of internal and external technologies.
The Tensor G5 will combine Google’s proprietary elements, such as its Tensor Processing Unit (TPU), Digital Signal Processor (DSP), memory compressor, and audio processor, with components sourced from other companies like Arm and Imagination Technologies. In a notable move, the chip’s video codec will replace Google’s custom “BigWave” and Samsung’s Media Format Codec (MFC) with an off-the-shelf solution from Chips&Media, while transitioning the display controller away from Samsung’s DPU to VeriSilicon’s DC9000. Furthermore, the image signal processor (ISP) has undergone a complete redesign, with Google creating its own ISP from scratch, a notable improvement over the Samsung-customized ISP used in the Tensor G4.
Historically, Tensor chips have relied on a blend of Google’s custom designs and components from Samsung, utilizing Samsung’s foundry and Exynos platform for foundational support. Prior to the Tensor series debut in 2021, Google had explored custom ISPs for its Snapdragon-powered Pixels, starting with the Pixel Visual Core in the Pixel 2 and the Pixel Neural Core in the Pixel 4. With TSMC’s advanced 3nm N3E process for the Tensor G5, Google aims to enhance performance and efficiency in the Pixel 10.
While the new components might not drastically alter performance, the increased control over chip design could lead to improved camera quality and overall system stability. The Tensor G5 is poised to elevate the Pixel experience, emphasizing next-generation AI capabilities, superior camera functions, and a more cohesive user experience in future models.
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