Since the launch of the Pixel 6 in 2021, Google has utilized Samsung’s foundry to produce its Tensor chips. However, this reliance has resulted in various challenges, as Samsung’s fabrication process has lagged behind TSMC’s superior technology, leading to overheating and battery life problems with the chips. With the anticipated release of the Google Pixel 10, the company appears to be transitioning to TSMC’s advanced fabrication process, which has reportedly surprised Samsung executives. Samsung’s foundry arm has faced considerable difficulties.
Its latest nodes have not performed as well as TSMC’s, displaying issues like high power consumption and low yield rates. Until now, Google was one of the few major smartphone manufacturers to rely on Samsung for its chips, resulting in Tensor chips being criticized for their overheating and energy inefficiencies. In the upcoming Pixel 10, Google plans to create the Tensor G5 chip using TSMC’s cutting-edge 3nm technology, similar to what Apple employs for its iPhone’s A-series chips. While the transition will not likely introduce significant performance enhancements due to sticking to older CPU cores, the shift is expected to greatly improve battery life and thermal management.
Furthermore, Google’s partnership with TSMC appears to be long-term, extending through several future Pixel devices. This unexpected move has prompted Samsung’s Electronics division to convene a strategic meeting to address how to regain competitiveness in its foundry services. Google’s recent entry into the foldable phone market may have also influenced its decision to leave Samsung for TSMC, underscoring the challenges Samsung faces with its foundry business. Additionally, Samsung’s Exynos modems have been an ongoing issue for Pixel devices, known for their poor connectivity compared to those from MediaTek and Qualcomm.
Although the Pixel 9 features a more capable Exynos 5400 modem, the foundry’s technology improvements have not matched the advancements seen in other sectors.
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